Jpl Jobs – Electronics Packaging Delivery Lead

Job Description:

We are seeking an Electronics Packaging Delivery Lead, with a consistent track record of delivering electro-mechanical hardware, advising electronic packaging engineering design for manufacturability and electronic packaging for thermal and structural stress analyses. As a Packaging Delivery Lead (PDL) you will lead a team of engineers in creating “storyboards”, which map the electro-mechanical design concept for electronic subsystems for and not limited to power and instrument electronics subsystem. This technical lead will be a member of the Electronic Packaging Engineering group in the Electronic Manufacturing, Packaging, & Technical Services Section.

Job Responsibilities:

• Responsible for electronic packaging design and analyses.
• Collaborate with engineers and QA to ensure packaging designs for manufacturability lesson learned is incorporated.
• Lead design teams in a collaborative environment to design, develop tools and support equipment for the project.
• Work independently, and under the direction of the group supervisor, project management and technical lead.
• Collaborate with engineers to develop solutions to resolve discrepancies and escapes with hardware fabrication.
• Estimate cost, workforce, develop schedule, manage deliverables, manage the EFab and Design-to-Delivery (D2D), and report them to the project at the monthly management review and at the project reviews milestones.
• Serve as Electronics Packaging Delivery Lead or Lead Packaging Engineer position on a JPL project.

Job Requirement:

• Experience in mechanical engineering fields for the design, analysis and test of electro- mechanical system and subsystem, including materials and processes, manufacturing engineering, machine shop practices, interconnect design and electronic assembly/subsystem/system environmental test.
• Knowledge of Standards for Geometric Dimensioning and Tolerancing (GD&T) per American Society of Mechanical Engineers (ASME) Y14.5.
• Experience in delivering electronic flight hardware from design through fabrication, assembly and test.
• Experience in managing a complex combination of individuals with varying technical skills.
• Knowledge in industry standards in design, manufacturing and assembly of printed wiring boards.
• Advanced knowledge of industry and/or academic practices and/or standards in several of these areas: 1) drawing requirements 2) drawing release, 3) inspection reports, 4) Surface Mount Technology (SMT) electronics manufacturing.
• Experience in Design, Build, Assembly and Test processes for electronic packaging boards and assemblies.
• Excellent written and verbal communication skills and organizational skills.
• Proven ability to work in a team environment and meet deadlines.

Job Details:

Company: JPL

Vacancy Type:  Full Time

Job Location: Los Angeles, CA, US

Application Deadline: N/A

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